Intel® IXDP2351 Advanced Development Platform

Modular AdvancedTCA* Platform to Accelerate Development of Network Access and Edge Applications Based on the Intel® IXP2350 Network Processor The Intel® IXDP2351 Advanced Development Platform enhances the value of the Intel® IXP2350 network processor by providing a robust environment that can dramatically accelerate the development and validation of new products designed for T1/E1/J1 to OC-12 line rates. The development platform may be used in several ways

		Developers can write code and run simulation in a Windows*-based PC environment using the graphical workbench and the cycle-accurate simulator, and then verify system functionality even before the target hardware is available.
		Hardware design engineers can use schematic source files and other design documents, such as design guides and mechanical drawings included in the web-based Intel® Internet Exchange Architecture (Intel® IXA) Hardware Development Kit to jump-start board development.
		Developers can validate a design using the base card, network processor module, and mezzanine cards available from Intel, or design and test a custom I/O subsystem using the development platform prior to committing to a full board design.
		With the IXDP2351 platform, developers can add extra AdvancedTCA* boards from Intel as well as third parties to prototype more complete systems.
		Developers can support a variety of AdvancedTCA fabric interfaces through a defined fabric interface mezzanine. Features and Benefits Processor Single Intel® IXP2350 network processor configured to run at various Intel XScale® core and microengine speed rates Interfaces SPI-3 for mezzanine/fabric Media Switch Fabric (MSF) configurable to support: SPI-3, HSS, Fast Ethernet, UTOPIA Master or Slave and Gigabit Ethernet mode Memory 64MB flash memory One QDR SRAM channel: with a modular QDR-II interface for an optional 16MB QDR-II SRAM module (up to 200 MHz/400 MT or a TCAM module — available from third parties) 768 MB DDR DRAM + ECC 512MB CPP DDR DRAM + ECC 256MB XSI DDR DRAM + ECC I/O Option Cards Intel® IXD4OC12T1F Quad OC-3/OC-12 I/O Option Card (four port OC-3 and two port OC-12 are supported) Intel® IXD4GET0C Quad Gigabit Ethernet I/O Option Card - Copper (Only two GbE ports usable with IXDP2351 development platform) Intel® IXD16DS1T2C 16-port T1/E1/J1 RTM Memory Modules Intel® IXQDR2416 16MB QDR-II SRAM Memory Module Chassis Specifications Description Intel® IXDP2351 Chassis Regulatory Information Complies with FCC Part 15, ICES-003, CE (EN55022), VCCI, GOST-R, and RRL MIC for Class A Emissions Complies with CISPR 24/EN55024, EN61000-3-2, EN61000-3-3 Complies with IEC/EN/UL 60950 for UL/cUL, CE, and GOST-R Physical Dimension 436mm x 386mm x 5U Weight (chassis only - fully loaded system) 31 lb. chassis only; up to 70 lbs. for fully loaded system Power Input Autosensing 100-240 VAC, 50-60 Hz, 15-7.4 Amps Power Supply Output (External) -48 VDC (25A), 1200 watts Operating Temperature 0° to 40° C Storage Temperature -40° to 70° C Standards Compliance PICMG 3.0 AdvancedTCA Chassis specifications Cooling 200W per slot Backplane Mounting provision for five (5) 8Ux280mm AdvancedTCA boards and five (5) 8Ux70mm Rear Transition Modules and two (2) Schroff 4Ux4HP shelf managers Product Names Intel® IXDP2351 Advanced Development Platform Intel® IXDP2351 Advanced Development Platform (includes Intel® IXMB2351 Base Card, Chassis, Shelf Manager and 1200W external power supply) Base Card Intel® IXMB2351 Single Network Processor Base Card (includes Intel® IXNPM2350 Network Processor Module) Option Cards Intel® IXD4OC12T1F Quad OC-3/OC-12 I/O Option Card Intel® IXD4GETOC Quad Gigabit Ethernet I/O Option Card Intel® IXD16DS1T2C 16-port T1/E1/J1 I/O Option Card Intel® IXQDR2416 16MB QDR-II SRAM Memory Module Option Card