Intel® IXP465 Network Processor

The Intel® IXP465 network processor is a member of the Intel® IXP46X product line for SME communications and embedded networking applications. The Intel IXP465 network processor is an addition to the Intel® IXP4XX product line of network processors, and extends Intel XScale® technology into a broad range of applications that require communications functionality. The consistency of the Intel IXP4XX product line software and hardware architecture protects customers' development investments and speeds development of a standards-based product portfolio. The highly integrated, single-chip design of the IXP465 network processor provides a unique combination of performance, reliability and flexibility. The IXP465 network processor combines Intel XScale technology with a variety of built-in communications features to support requirements for modular routers, security appliances, line cards for telecommunications infrastructure, industrial control and automation applications, interactive clients, test and instrumentation, RFID readers, and networked print imaging applications. The high-performance Intel XScale core provides processing headroom to flexibly support a broad range of OEM applications while minimizing power consumption. Integration of multiple 10/100 Ethernet interfaces and built-in hardware acceleration for time synchronization reduces overall system cost and simplifies development. Product Highlights Member of Intel® IXP46X product line of network processors for small-to-medium enterprise (SME) communications and embedded networking applications Intel XScale® core speeds of up to 667 MHz provides scalable processing headroom for target applications Built-in LAN and WAN, I2C and Synchronous Serial Port (SSP) interfaces reduce overall system cost and simplify development Integrated support for cryptography, time synchronization and ECC memory improves performance and reliability Consistent Intel® IXP4XX product line software and hardware architecture protects customers’ development investments and speeds deployment of a standards-based product portfolio Robust development environment minimizes time-to-market

Features and Benefits

Intel XScale® core Available at 266 MHz, 400 MHz, 533 MHz and 667 MHz Delivers high MIPS/power consumption ratio and provides ample processing headroom for value-added software features 32-bit 33/66 MHz PCI v2.2, host and option interface Provides flexibility to directly connect devices including 802.11x chips, PCMCIA controllers and cable MACs/PHYs USB USB v. 1.1 device controller USB v. 2.0 host controller, supports low-speed and full-speed modes only Industry-standard interface for connection to a wide array of devices 32-bit, DDR1-266 SDRAM interface Optional ECC 32MByte to 1GByte of memory High-bandwidth memory interface Optional ECC improves system reliability 32-bit Expansion bus interface with parity Master/Target capable 25-bit address Glueless connection to most other devices External mastering capability allows external devices to communicate with each other and with internal peripherals resulting in shared memory subsystem design and lower system cost> Integrated Ethernet MACs Up to three integrated 10/100 Ethernet MACs with SMII interface Up to three integrated 10/100 Ethernet MACs with MII interface Industry-standard networking interface lowers system bill of materials (BOM) cost Multiple ports allow: Lower system cost Multiple LAN port support Concatenation of networking modules UTOPIA-2 Interface with multiple ADSL/G.SHDSL or VDSL PHY support Industry standard WAN interface Two high-speed serial (HSS) ports for connecting to T1/E1 or SLIC/CODECs Connects to T1/E1 or SLIC/CODECs for voice support Silicon functional assistance for Random Number Generation Accelerates public key exchange and authentication and key generation Integrated hardware support for popular cryptography algorithms Acceleration for popular applications such as IPSec and SSL VPNs (AES/AES-CCM/3DES/DES/SHA-1/SHA-256/ SHA-384/SHA-512/MD-5/RSA/DSA/Diffie-Hellman algorithms) Hardware support for IEEE1588 protocol Hardware assistance for Time Synchronization in a distributed control system containing multiple clocks Two high-speed UARTs support up to 921Kbaud each Provides an interface for debug and passing control information Integrated I2C and SSP interfaces Provides serial interfaces for common embedded and communications application: reduces system BOM cost Spread spectrum clocking Improves system reliability by reducing EMI Comprehensive pre-validated pre-integrated "out-of-the-box" development infrastructures ready for application development using Linux*, VxWorks* Ease of design and fast time-to-market 544-Ball PBGA Package 35mm x 35mm, 1.27mm ball pitch Lead-free packages available Commercial temperature (0° to 70° C) Extended temperature (-40° to 85° C) High-performance package provides improved reliability Lead-free packages help to meet environmental regulations Extended temperature support for industrial control and automation applications

Intel® IXDP2351 Advanced Development Platform

Modular AdvancedTCA* Platform to Accelerate Development of Network Access and Edge Applications Based on the Intel® IXP2350 Network Processor The Intel® IXDP2351 Advanced Development Platform enhances the value of the Intel® IXP2350 network processor by providing a robust environment that can dramatically accelerate the development and validation of new products designed for T1/E1/J1 to OC-12 line rates. The development platform may be used in several ways

		Developers can write code and run simulation in a Windows*-based PC environment using the graphical workbench and the cycle-accurate simulator, and then verify system functionality even before the target hardware is available.
		Hardware design engineers can use schematic source files and other design documents, such as design guides and mechanical drawings included in the web-based Intel® Internet Exchange Architecture (Intel® IXA) Hardware Development Kit to jump-start board development.
		Developers can validate a design using the base card, network processor module, and mezzanine cards available from Intel, or design and test a custom I/O subsystem using the development platform prior to committing to a full board design.
		With the IXDP2351 platform, developers can add extra AdvancedTCA* boards from Intel as well as third parties to prototype more complete systems.
		Developers can support a variety of AdvancedTCA fabric interfaces through a defined fabric interface mezzanine. Features and Benefits Processor Single Intel® IXP2350 network processor configured to run at various Intel XScale® core and microengine speed rates Interfaces SPI-3 for mezzanine/fabric Media Switch Fabric (MSF) configurable to support: SPI-3, HSS, Fast Ethernet, UTOPIA Master or Slave and Gigabit Ethernet mode Memory 64MB flash memory One QDR SRAM channel: with a modular QDR-II interface for an optional 16MB QDR-II SRAM module (up to 200 MHz/400 MT or a TCAM module — available from third parties) 768 MB DDR DRAM + ECC 512MB CPP DDR DRAM + ECC 256MB XSI DDR DRAM + ECC I/O Option Cards Intel® IXD4OC12T1F Quad OC-3/OC-12 I/O Option Card (four port OC-3 and two port OC-12 are supported) Intel® IXD4GET0C Quad Gigabit Ethernet I/O Option Card - Copper (Only two GbE ports usable with IXDP2351 development platform) Intel® IXD16DS1T2C 16-port T1/E1/J1 RTM Memory Modules Intel® IXQDR2416 16MB QDR-II SRAM Memory Module Chassis Specifications Description Intel® IXDP2351 Chassis Regulatory Information Complies with FCC Part 15, ICES-003, CE (EN55022), VCCI, GOST-R, and RRL MIC for Class A Emissions Complies with CISPR 24/EN55024, EN61000-3-2, EN61000-3-3 Complies with IEC/EN/UL 60950 for UL/cUL, CE, and GOST-R Physical Dimension 436mm x 386mm x 5U Weight (chassis only - fully loaded system) 31 lb. chassis only; up to 70 lbs. for fully loaded system Power Input Autosensing 100-240 VAC, 50-60 Hz, 15-7.4 Amps Power Supply Output (External) -48 VDC (25A), 1200 watts Operating Temperature 0° to 40° C Storage Temperature -40° to 70° C Standards Compliance PICMG 3.0 AdvancedTCA Chassis specifications Cooling 200W per slot Backplane Mounting provision for five (5) 8Ux280mm AdvancedTCA boards and five (5) 8Ux70mm Rear Transition Modules and two (2) Schroff 4Ux4HP shelf managers Product Names Intel® IXDP2351 Advanced Development Platform Intel® IXDP2351 Advanced Development Platform (includes Intel® IXMB2351 Base Card, Chassis, Shelf Manager and 1200W external power supply) Base Card Intel® IXMB2351 Single Network Processor Base Card (includes Intel® IXNPM2350 Network Processor Module) Option Cards Intel® IXD4OC12T1F Quad OC-3/OC-12 I/O Option Card Intel® IXD4GETOC Quad Gigabit Ethernet I/O Option Card Intel® IXD16DS1T2C 16-port T1/E1/J1 I/O Option Card Intel® IXQDR2416 16MB QDR-II SRAM Memory Module Option Card